We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.
| Material | Flex | Functional Application | Amplification |
| Type | electronic board | Base Material | FR4 CEM PTFE Ceramic ROGERS HighTG |
| Board Thickness | 0.4-8mm | Copper Thickness | 0.5oz 1oz 2oz 3oz or custom |
| Min. Hole Size | 0.1mm | Min. Line Width | 3/3mil |
| Min. Line Spacing | 3/3mil | Surface Finishing | ENIG,Gold Finger,HASL,OSP,ENEPIG,other |
| Board Size | 10*10mm min 22.5*30inch max | Max Layer | 60L |
| Inner Layer Min Trace/Space | 3/3mil | Out Layer Min Trace/Space | 3/3mil |
| Inner Layer Max Copper | 6oz | Out Layer Max Copper | 6oz |
| Min Mechanical Drilling | 0.1mm | Min Laser Drilling | 0.1mm |
| Aspect Ratio(Mechanical Drilling) | 20:1 | Aspect Ratio(Laser Drilling) | 1:1 |
| Keywords | Professional PCB Manufacturer |