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Potting Compound for Electronics Silicone Potting Compound
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Potting Compound for Electronics Silicone Potting Compound

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageConstruction, automobile
Main Raw Materialthermal gap fillerEINECS No.1
CAS No.1MF1
Other Namesthermal gap fillerTypesilicone potting compound
ColorGreyMaterialSilicone rubber
Hardness35 Shore ATensile Strength200KPa
Thermal conductivity2.0 WmkDensity2.3 gcm3
Dielectric Strength≥10 KV mmDielectric constant(1000Hz)4.7~5.5
Flame retardanceV-0Elongation at break12%
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