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Modified Epoxy Resin Conductive Two-part Glue High Ag Content for Semiconductor Target Binding and Transportation Applications

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Modified Epoxy Resin Conductive Two-part Glue High Ag Content for Semiconductor Target Binding and Transportation Applications

Name: Modified Epoxy Resin Conductive Two-part Glue High Ag Content for Semiconductor Target Binding and Transportation Applications - Rensino Chemical Industrial Co., Ltd
SKU: ER-1006

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Double Components Adhesives	Usage	Transportation, Target binding
Main Raw Material	Epoxy	CAS No.	N/A
MF	Mixture	Other Names	Epoxy modified thermally and electrically conducti
Type	Two-part	Product name	Epoxy modified thermally and electrically conducti
Material	Epoxy adhesives	Tensile strength	≥10 MPa
Viscosity A&B(10:1)	16000 cps	Component	Two-part
Part A& Part B	Epoxy modified resin & Curing agent	Mixing Ratio	A:B=(10:1)(Weight ratio)
Hardness	65±5	Shelf life@ <10℃	6 months
Application	Target binding

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