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Modified Epoxy Conductive Adhesive 16000cps Viscosity 10 MPa Tensile Strength for Semiconductor Transportation
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Modified Epoxy Conductive Adhesive 16000cps Viscosity 10 MPa Tensile Strength for Semiconductor Transportation

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageTransportation, Target binding
Main Raw MaterialSilicone resinCAS No.N/A
MFMixtureOther NamesEpoxy modified thermally and electrically conducti
TypeTwo-partProduct nameEpoxy modified thermally and electrically conducti
MaterialEpoxy adhesivesTensile strength≥10 MPa
Viscosity A&B(10:1)16000 cpsComponentTwo-part
Part A& Part BEpoxy modified resin & Curing agentMixing RatioA:B=(10:1)(Weight ratio)
Hardness65±5Shelf life@ <10℃6 months
ApplicationTarget binding
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