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Low Viscosity High Adhesion Epoxy Resin 1.0 Thermal Conductivity Black Cast PCB Potting Compound

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Low Viscosity High Adhesion Epoxy Resin 1.0 Thermal Conductivity Black Cast PCB Potting Compound

Name: Low Viscosity High Adhesion Epoxy Resin 1.0 Thermal Conductivity Black Cast PCB Potting Compound - Rensino Chemical Industrial Co., Ltd
SKU: ER-1863

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Double Components Adhesives	Main Raw Material	Epoxy
EINECS No.	231-545-4	CAS No.	67763-03-05
MF	mSiO2 nH2O	Other Names	epoxy resin and hardener
Type	Two Component	Product name	Potting Glue For Electronic
Application	Sealing Construction	Keywords	electronic potting glue
Viscosity	40000-45000	Advantage	Suitable High Temperate Climates
Color	Transparent	Material	Pure Epoxy
MOQ	1 KG	Certificate	rohs
Packing	Bottle

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