| Classification | Double Components Adhesives | Usage | Other |
| Main Raw Material | Epoxy | EINECS No. | 26-823-5 |
| CAS No. | 1675-54-3 | MF | C21H24O4 |
| Other Names | Epoxy Resin Compound | Type | Epoxy resin for Electrical Insulation |
| Epoxy resin for Electrical Insulation | PAG resin system |
Leave A Message