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High Thermal Conductivity Epoxy Potting Compound for Electronics Flame Retardant V0 Adhesive
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High Thermal Conductivity Epoxy Potting Compound for Electronics Flame Retardant V0 Adhesive

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ClassificationDouble Components AdhesivesUsageElectric power
Main Raw MaterialEpoxy ResinEINECS No.no
CAS No.noMFno
Other NamesEpoxy Potting adhesiveTypeLiquid glue
MaterialEpoxyMixing ratio A:B5:1,10:1,100:12
Operable time (35℃)≥30 minCuring Time (h)25℃ 24-48h / 80℃ 2-4h
Hardness (shore D)>75 / >80Thermal conductivity coefficient (W/mK)≥0.6
Volume resistivity (Ωcm)≥10 13Temperature resistance (℃)-30 – 110℃ / >150℃
Flame retardancyV0keywordsEpoxy Potting Compound
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