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High Thermal Conductivity Black Two Component Epoxy Potting Sealant for Construction Electronic Components
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High Thermal Conductivity Black Two Component Epoxy Potting Sealant for Construction Electronic Components

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationOther AdhesivesUsageConstruction, Transportation, Woodworking
Main Raw MaterialEpoxyEINECS No.210-898-8
CAS No.61788-97-4MFC21H23ClFNO2
Other NamesEpoxy potting sealantTypeTwo component Epoxy potting sealant
Product nameEpoxy potting sealantColorBlack
ApplicationEncapsulating and potting of flame retardantOEM & ODMYes, OEM & ODM are Welcome
Packing25 drumAdvantageHigh Quality & Competitive price
Delivery time10-20daysMOQ1000kg
Shelf12monthsThermal Conductivity0.6w/mk
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