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High Performance High Temperature Resistance SD6341 Epoxy Resin Thermally Conductive Liquid Gel Material Potting Compound
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High Performance High Temperature Resistance SD6341 Epoxy Resin Thermally Conductive Liquid Gel Material Potting Compound

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesMain Raw MaterialEpoxy
EINECS No.238-878-4CAS No.10279-57-9
MFSiO2.XH2OOther NamesEpoxy Potting Compound
TypeTwo ComponentProduct nameEpoxy Resin Potting Sealant
ApplicationBallast, lighting trigger, dry type transformer, relay etcColorTransparent
Other nameElectronic potting sealantMaterialEpoxy Resin+hardener
KeywordsEpoxy Resin Potting SealantMixing Ratio4:1
Delivery Time15daysShippingExpress(Fedex
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