We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.
| Classification | Double Components Adhesives | Usage | Mainly used in electronic packaging, bonding, composite materials and other fields. |
| Main Raw Material | Epoxy | EINECS No. | 210-898-8 |
| CAS No. | 38891-59-7 | MF | C6H7N02 |
| Other Names | Epoxy Resin Liquid | Epoxy equivalent(g/eq) | 170-180 |
| APHA | <30 | viscosity(mpa.s,25℃) | 3000-5000 |
| Total chlorine ppm | 800 | hydrolyzable chloride ppm | 200 |
| Product features | High purity, low viscosity, and low total chlorine |