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Epoxy Thermal Conductive Potting Adhesive Aluminum Powder Low Viscosity No Leakage After Curing Thermal Interface Material
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Epoxy Thermal Conductive Potting Adhesive Aluminum Powder Low Viscosity No Leakage After Curing Thermal Interface Material

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageTransportation, Electronics & power module,LED driver,luminaires, Packing
Main Raw MaterialPolyurethaneCAS No.NA
MFMIXTUREOther NamesV0 Epoxy thermal conductive potting adhesive
TypeEpoxy resin thermal conductivity potting adhesiveMaterialEpoxy resin,composite ceramic powder
Product nameHardness Epoxy thermal conductivity potting adhesiveColorDark grey and white
ApplicationElectronics & power module,LED luminairesKeywordsEpoxy resin thermal conductivity potting adhesive
Storage condition≤23℃Density1.9 g/cm³
Thermal conductivity1.0W/(mk)Advantageheat conduction,Good flame retardancy ,waterproof,
Shelf life≤23℃6 months
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