other
Epoxy Resin Potting Adhesive for LED Electronic Components High Voltage Resistant Thermally Conductive Black Insulating AB Glue
Home  /  Products  /  Epoxy Resin Potting Adhesive for LED Electronic Components High Voltage Resistant Thermally Conductive Black Insulating AB Glue

Epoxy Resin Potting Adhesive for LED Electronic Components High Voltage Resistant Thermally Conductive Black Insulating AB Glue

  • Product Detail
We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageOther
Main Raw MaterialEpoxyTypeEpoxy resin adhesive
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)
Related Products
Details
Transparent Hard AB Glue Epoxy Resin Curing Agent Two-Component High Hardness Circuit Board Insulation Encapsulation Potting

Classification Double Components Adhesives Usage Other Main Raw Material Epoxy Type AB glue

Details
E6000 B7000 Clear Glue Epoxy Resin for Mobile Phone Repair LCD Screen Glass Frame Flower Pot Crystal Rhinestones Glue

Classification Other Adhesives Usage Construction, Packing Main Raw Material Epoxy EINECS No. no CAS No. 3206912000 MF no Other Names T7000 E8000 Product name B7000 Color Transparent Type Liquid Glue Application Artwork MOQ 100pcs OEM Availble Use Sticker Shelf life 12 Months Package 10ml,50ml,110ml

Details
12852 DIY Craft 8cm Cube Silicone Molds Square Silicone Molds Resin Epoxy Casting Molds

number of pieces 1 cake tools type Moulds material Silicone feature Reusable Shape Square Items Cube Silicone Molds Color clear MOQ 10pcs Packaging Polybag or custom packaging Material silicone sample available size 8cm

Details
Black Epoxy Potting Compound Two Component High Gloss Surface LED Driver Power Supply CC2000P Thermal Conductivity

Classification Double Components Adhesives Usage Electronic Components Main Raw Material Epoxy Resin EINECS No. 500-033-5 CAS No. 25068-38-6 Other Names Epoxy Potting Compound Type Two-Component Material Type Two-component Epoxy Resin Mixing Ratio 5:1 (A:B by Weight) Density after mixing 1.65±0.05 g/cm3 Hardness (Shore D) 85 ± 5 D Mixed Viscosity 1000-2000 mPa.s Thermal Conductivity ≥0.3 […]

Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)

Home

Products

about

contact