We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.
| Classification | Double Components Adhesives | Usage | Electrical Insulation |
| Main Raw Material | Epoxy | EINECS No. | 247-830-1 |
| CAS No. | 26590-20-5 | MF | C9H10O3 |
| Other Names | Epoxy Resin Potting Compound | Type | Liquid Epoxy Resin |
| Epoxy Resin | LE-8217V | Resin Hardener | LH-8217V |
| Mix temperature | 40°C/1-2hours | Feeding process | pressure(0.5-5bar) |
| Mold temperature | 130-150 °C | Gelation times | 10-30mins |
| Cure conditions | 130-140°C*10-12hours | Appearance | Colourless Liquid |
| Application | Insulators etc. | Main Raw Material | Resin |