other
Epoxy Resin Compound Casting Epoxy Resin for Electronics Insulation Parts
Home  /  Products  /  Epoxy Resin Compound Casting Epoxy Resin for Electronics Insulation Parts

Epoxy Resin Compound Casting Epoxy Resin for Electronics Insulation Parts

  • Product Detail
We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageelectronic insulation
Main Raw MaterialEpoxy resinEINECS No.1675-54-3
CAS No.61788-97-4MFC39H36O7
Other Namesepoxy resin adhesiveTypeTwo Component
AppearanceGoldenViscous LiquiidApplicationelectrical insulation
Materialepoxy resinCertificateISO REACH ROHS
Shelf life12 MonthsPacking25kgs/barrel
ViscosityExcellent ViscosityComponentTwo Component AB Glue
Delivery Time10~15 DaysMOQ25KGS
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)
Related Products
Details
High Temperature Resistant Epoxy Resin 2 Part Resina Epoxi Kit for Electronic Grade Potting

Classification Double Components Adhesives Usage Construction, Packing, Woodworking Main Raw Material Epoxy EINECS No. 231-072-3 CAS No. 38891-59-7 MF C15H16O2C2H7ONC3H5OCl Other Names Crystal epoxy resin Type Liquid Coating Product name Epoxy Resin Use Transportation, Construction, Woodworking Material Liquid Epoxy Resin Advantage High Gloss,No yellow,Crystal Clear, Low odor, Self Levelling Shelf Life 6 Months Delivery Time […]

Details
Electronic Potting Compound Epoxy Two-Component High Thermal Conductivity Low Viscosity RoHS REACH Compliant 19 KV/mm

Classification Double Components Adhesives Usage Electronic Components Main Raw Material Epoxy Resin EINECS No. 500-033-5 CAS No. 25068-38-6 Other Names Epoxy Potting Compound Type Two-Component Material Type Two-component Epoxy Resin Mixing Ratio 5:1 (A:B by Weight) Density after mixing 1.65±0.05 g/cm3 Hardness (Shore D) 85 ± 5 D Mixed Viscosity 1000-2000 mPa.s Thermal Conductivity ≥0.3 […]

Details
Low Shrinkage High-Quality Composite Epoxy Resin for Precision Mold Making and Casting BE504

Product Type Solid CAS No. 25036-25-3 Applications Protective coatings,Filling materials & patching compounds,Adhesives

Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)

Home

Products

about

contact