We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.
| Classification | Double Components Adhesives | Usage | embedding electronic components |
| Main Raw Material | Epoxy | CAS No. | 38891-59-7 |
| Other Names | epoxy potting compound | Type | Two-components |
| Product name | Two-Component Epoxy Resin Potting Adhesive | Application | embedding electronic components |
| Main Material | epoxy resin | Feature | self-leveling |
| Characteristic | cold curing | Advantage | aging resisitance,moisture resistance,insulation |
| Keywords | electronic adhesive | Full curing time (h) | 48 |
| hardness (S.D) | ≥80 | Certificate | ROHSREACH |