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Copper Clad Laminate Paper Phenolic Sheet XPC FR1 for PCB Processing

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Copper Clad Laminate Paper Phenolic Sheet XPC FR1 for PCB Processing

Name: Copper Clad Laminate Paper Phenolic Sheet XPC FR1 for PCB Processing - Rensino Chemical Industrial Co., Ltd
SKU: ER-5858

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Rated Voltage	33KV	Type	Insulation Sheet
Material	Fiberglass	Application	Electronics Device
Thickness	0.8-1.6mm	Color	Brown

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