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Bisphenol a Epoxy Resin Clear Liquid Adhesive for Electronics Industrial Coating and Insulating Material for IC Packaging
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Bisphenol a Epoxy Resin Clear Liquid Adhesive for Electronics Industrial Coating and Insulating Material for IC Packaging

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationOther AdhesivesUsageConstruction, Packing, Transportation
Main Raw MaterialEpoxy ResinEINECS No.500-004-6
CAS No.38891-59-7MF(C11H12O3)n
Other NamesNAN YA EPOXY RESINTypeStandard Epoxy Resin
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