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5213AB Modified Epoxy Resin AB Adhesive for Electronic Circuit Board Encapsulation and Waterproofing
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5213AB Modified Epoxy Resin AB Adhesive for Electronic Circuit Board Encapsulation and Waterproofing

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

UsageConstructionMain Raw MaterialAcrylic
Other Namespotting adhesive
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