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5 1 Heat Conductive Epoxy Resin Formula Moisture Proof Bubble Free for Electronic Potting for Packing Glue Adhesive Products
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5 1 Heat Conductive Epoxy Resin Formula Moisture Proof Bubble Free for Electronic Potting for Packing Glue Adhesive Products

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageWoodworking, Construction
Main Raw MaterialEpoxyEINECS No.500-033-5
CAS No.9082-00-2MFC15H16O2C2H7ONC3H5OCl
Other NamesEpoxy Resin AB GlueTypeEpoxy Resin for Electronic Components Potting
Mixing RatioA:B=5:1ColorBlack
ApplicationEpoxy Resin for Electronic Components PottingMaterialEpoxy Resin+Hardener
KeywordsEpoxy Resin LiquidFeatureEco-friendly
Shelf life12 MonthsPackingCarton
MOQ1 KGOEMOEM Services Provided
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