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150℃ High Temperature Resistant Electronic Potting Compound Low Viscosity Epoxy Resin
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150℃ High Temperature Resistant Electronic Potting Compound Low Viscosity Epoxy Resin

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageConstruction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking
Main Raw MaterialEpoxyEINECS No.231-545-4
CAS No.67763-03-05MFmSiO2 nH2O
Other NamesEpoxy adhesiveTypeTwo Component
Product nameepoxy electronic potting glueApplicationSealing Construction
KeywordsEpoxy Resin LiquidViscosity2000-3000cps
AdvantageSuitable High Temperate ClimatesColorBlue
MaterialPure EpoxyMOQ1 KG
PackingBottle
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