Potting Compound for Electronics Silicone Potting Compound

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Classification	Double Components Adhesives	Usage	Construction, automobile
Main Raw Material	thermal gap filler	EINECS No.	1
CAS No.	1	MF	1
Other Names	thermal gap filler	Type	silicone potting compound
Color	Grey	Material	Silicone rubber
Hardness	35 Shore A	Tensile Strength	200KPa
Thermal conductivity	2.0 Wmk	Density	2.3 gcm3
Dielectric Strength	≥10 KV mm	Dielectric constant(1000Hz)	4.7~5.5
Flame retardance	V-0	Elongation at break	12%

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