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SE685 2 Part AB Epoxy Resin Adhesive Potting High Tensile Strength Epoxy Glue for Electronics

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SE685 2 Part AB Epoxy Resin Adhesive Potting High Tensile Strength Epoxy Glue for Electronics

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Other Adhesives	Usage	Transportation, Electronic
Main Raw Material	Polyurethane	EINECS No.	210-898-8
CAS No.	9009-54-5	MF	CH3H8N2O
Other Names	Electronic potting sealant	Type	Two component
Usage	Electronic potting	Color	Light yellow transparent
Material	Epoxy	Mix rate	100:13
Application	Electronic, PCB, IGBT, Charging	Advantage	Elastic, weather resistant
OEM & ODM	Free OEM & ODM service	Samples	Free samples
Packing	25kg BUCKET

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