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1:1 Mix Epoxy Resin Sealant Potting Adhesive for Electronic Components Protection
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1:1 Mix Epoxy Resin Sealant Potting Adhesive for Electronic Components Protection

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageembedding electronic components
Main Raw MaterialEpoxyEINECS No.500-033-5
CAS No.38891-59-7MFC15H16O2 C2H7O
Other Namesepoxy potting compoundTypeTwo-components
Product nameTwo-Component epoxy potting compoundApplicationelectronic components
Main Materialepoxy resinFeatureself-leveling
Characteristiccold curingAdvantageaging resisitance,moisture resistance,insulation
Keywordselectronic adhesiveFull curing time (h)48
hardness (S.D)≥80CertificateROHSREACH
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