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Electronic Grade Epoxy Potting Resin 1 1 Self leveling Insulation Material for PCB
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Electronic Grade Epoxy Potting Resin 1 1 Self leveling Insulation Material for PCB

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsagewidely used
Main Raw MaterialEpoxyCAS No.4468-64-8
MFC6H12OOther Namesepoxy resin
Typeepoxy structural adhesiveProduct nameHY411 Epoxy Structural Adhesive
Main materialepoxyApplicationwidely use
Colorsemi-transparentViscosity (Pa.s)fluid
Full cure time24hPressing shear strength25 Mpa
Impact strength18 JOperating temperature-60~100
Package500g/ set
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