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HY484 Epoxy Resin Potting Compound Solvent Free Black Self-Leveling Epoxy Potting Adhesive for Circuit Board Encapsulation
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HY484 Epoxy Resin Potting Compound Solvent Free Black Self-Leveling Epoxy Potting Adhesive for Circuit Board Encapsulation

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ClassificationDouble Components AdhesivesUsageembedding electronic components
Main Raw MaterialEpoxyEINECS No.500-033-5
CAS No.38891-59-7MFC15H16O2 C2H7O
Other Namesepoxy potting compoundTypeTwo-components
Product nameTwo-component epoxy potting compoundApplicationelectronic components
Featureself-levelingCharacteristiccold curing
Advantageaging resisitance,moisture resistance,insulationKeywordselectronic adhesive
Full curing time (h)48hardness (S.D)≥80
CertificateROHSREACHServiceSample+OEM+ODM+Private Label
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