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High-Hardness Epoxy Potting Compound Low Curing Stress for Filters and Sensors Impact Resistant Adhesive and Sealant

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High-Hardness Epoxy Potting Compound Low Curing Stress for Filters and Sensors Impact Resistant Adhesive and Sealant

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Double Components Adhesives	Usage	Electronic components, circuit boards, inverters
Main Raw Material	Epoxy	EINECS No.	00-00
CAS No.	00-00	MF	N/A
Other Names	Epoxy Potting Adhesive	Type	Double component epoxy sealant
Characteristic 1	Hardness Shore D 90, low viscosity, high permeability	Characteristic 2	High hardness, smooth surface, waterproof and oil resistant
Characteristic 3	Corrosion resistant, UL94V-0 flame retardant	Characteristic 4	Epoxy resin material, low curing stress
Characteristic 5	High hardness, aging resistance, impact resistance	Application scenarios	Used for potting protection of electronic components, circuit boards
Application scenarios 1	Used for sealing filters, transformers, and LED power supplies	Application scenarios 2	Used for potting AC capacitors and sensor products

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