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Resin Sealant Glue AB Glue Epoxy Potting Compound Adhesive for Electronic Potting Casting Encapsulation
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Resin Sealant Glue AB Glue Epoxy Potting Compound Adhesive for Electronic Potting Casting Encapsulation

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationOther AdhesivesUsageConstruction
Main Raw MaterialEpoxyEINECS No.231-525-8
CAS No.69852-05-02MFmSiO25OnH2O
Other NamesDouble Components AdhesivesTypeTwo Component
Product nameEpoxy Electrical Potting CompoundColorsTransparent
Shelf life6 Months/quality GuaranteeApplicationRelays, Controllers, Power Modules, Sensors
Customized serviceSupport OEM & ODMUseLED, Automotive Electronics, Regulators, Industrial Electronics
Functionflame retardancy, thermal conductivity, excellent flowabilityFeatureStrong adhesion, long-lasting hold, Non Toxic
Temperature Resistance– 50 to 130°CCertificatesCE, ROHS, Reach,etc
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