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Sepna Se685 Two Component Epoxy Resin Potting Adhesive for Control Module Charging Pile and DC Contactor Etc
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Sepna Se685 Two Component Epoxy Resin Potting Adhesive for Control Module Charging Pile and DC Contactor Etc

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationOther AdhesivesUsageTransportation, Electronic
Main Raw MaterialPolyurethaneEINECS No.210-898-8
CAS No.9009-54-5MFCH3H8N2O
Other NamesElectronic potting sealantTypeTwo component
UsageElectronic pottingColorLight yellow transparent
MaterialEpoxyMix rate100:13
ApplicationElectronic, PCB, IGBT, ChargingAdvantageElastic, weather resistant
OEM & ODMFree OEM & ODM serviceSamplesFree samples
Packing25kg BUCKET
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