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Epoxy Modified Conductive Adhesive Two-Component Target Bonding Conductive Epoxy for Semiconductor EMI Shielding
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Epoxy Modified Conductive Adhesive Two-Component Target Bonding Conductive Epoxy for Semiconductor EMI Shielding

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ClassificationDouble Components AdhesivesUsageTransportation, Target binding
Main Raw MaterialEpoxyCAS No.N/A
MFMixtureOther NamesEpoxy modified thermally and electrically conducti
TypeTwo componentProduct nameEpoxy modified thermally and electrically conducti
MaterialEpoxy adhesivesAppearanceA:Black paste& B:Light yellow liquid
Viscosity A&B35000 cpsComponentTwo-part
Part A& Part BEpoxy modified resin & Curing agentMixing RatioA:B=10:1(By Weight)
Hardness shore D65±5Shelf life@ <10℃6 months
ApplicationTarget binding
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