We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.
| Classification | Double Components Adhesives | Usage | Electronics |
| Main Raw Material | Silicone | EINECS No. | 24004253102 |
| CAS No. | 67762-94-1 | Other Names | Thermal Conductive Potting Compound |
| Type | Thermal Conductive Glue | Main Material | Vinyl polysiloxane |
| Application | Electrical insulating,LED potting,Automotive,Battery,Pv junction box | Feature | Higt thermal conductivity,Insulation |
| Advantage | Non-toxic,High-temperature resistance,Chemical resistance | Shelf life | 6 Months |
| MOQ | 100kg | Mixing Ratio | A:B=1:1 |
| OEM/ODM | Support | Curing time | 2min(100℃),15~30min(80℃) |
| Curing system | Room Temperature/Heat Curing Addition Molded Silicone Materials |