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Low Viscosity Two Component Thermal Conductive Epoxy Potting Compound for Electronic Device
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Low Viscosity Two Component Thermal Conductive Epoxy Potting Compound for Electronic Device

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageelectronic
Main Raw MaterialEpoxyCAS No.38891-59-7
Other NamesEpoxy resinTypeepoxy potting compound
Product nameepoxy potting compoundApplicationpotting and encapsulation power drive heat sensor
Colorwhite grey blackMaterialepoxy and hardener
Featureself-levelingAdvantagethermal conductive epoxy potting
ViscosityLow ViscosityMixing RatioA:B=5:1
Thermal conductivity0.7~2.0Curing systemreactive curing
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