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Epoxy Compounds for Potting and Encapsulation Low Exothermic Potting Resin Liquid Electrical Insulation Resin Epoxy
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Epoxy Compounds for Potting and Encapsulation Low Exothermic Potting Resin Liquid Electrical Insulation Resin Epoxy

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageConstruction, Fiber & Garment, Packing, Transportation, led potting
Main Raw MaterialEpoxyEINECS No.231-072-3
CAS No.38891-59-7MFC15H16O2C2H7ONC3H5OCl
Other Namesepoxy resin AB glueTypeliquid glue
ColorClearMixing Ratio5:1
CertificateROHS, REACH, PAHS, ASTM, EN-71Packingbottle
MOQ10 KGSShelf life6 Months
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