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Low Viscosity High Adhesion Epoxy Resin 1.0 Thermal Conductivity Black Cast PCB Potting Compound
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Low Viscosity High Adhesion Epoxy Resin 1.0 Thermal Conductivity Black Cast PCB Potting Compound

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesMain Raw MaterialEpoxy
EINECS No.231-545-4CAS No.67763-03-05
MFmSiO2 nH2OOther Namesepoxy resin and hardener
TypeTwo ComponentProduct namePotting Glue For Electronic
ApplicationSealing ConstructionKeywordselectronic potting glue
Viscosity40000-45000AdvantageSuitable High Temperate Climates
ColorTransparentMaterialPure Epoxy
MOQ1 KGCertificaterohs
PackingBottle
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