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High Thermal Conductivity Epoxy Resin High Hardness Low Viscosity Self Leveling Potting Compound for Transformer
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High Thermal Conductivity Epoxy Resin High Hardness Low Viscosity Self Leveling Potting Compound for Transformer

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesMain Raw MaterialEpoxy
EINECS No.231-545-4CAS No.67763-03-05
MFmSiO2 nH2OOther NamesEpoxy quick-drying adhesive
TypeTwo ComponentProduct nameElectronic-pouring sealant
ApplicationSealing ConstructionKeywordselectronic potting glue
Viscosity1500-2000AdvantageSuitable High Temperate Climates
ColorTransparentMaterialPure Epoxy
MOQ1 KGCertificaterohs
PackingBottle
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