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Deep Pour Industrial Epoxy Resin and Hardener Kit Potting Compound Electronics Filler Liquid AB Glue Adhesives Anti Leak Sealant

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Deep Pour Industrial Epoxy Resin and Hardener Kit Potting Compound Electronics Filler Liquid AB Glue Adhesives Anti Leak Sealant

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Double Components Adhesives	Usage	electronic circuit
Main Raw Material	Epoxy	EINECS No.	000
CAS No.	38891-59-7	Other Names	Epoxy Resin and Hardener
Type	Epoxy Potting Compound Circuit Boards	Product name	Epoxy AB Glue
Color	transparent colour	Shelf life	6 Months
Keywords	Epoxy Resin Liquid	Package	Customized Package
Certificate	MSDS RoHS	Feature	High temperature resistance/Impact resistance
Proportion	100:20

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