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HR SY 6606 Two Component Thermal Conductive Potting Compound A+B Epoxy Resin Adhesive for Electronic Encapsulation

Home / Products / HR SY 6606 Two Component Thermal Conductive Potting Compound A+B Epoxy Resin Adhesive for Electronic Encapsulation

HR SY 6606 Two Component Thermal Conductive Potting Compound A+B Epoxy Resin Adhesive for Electronic Encapsulation

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Other Adhesives	Usage	Other
Main Raw Material	Epoxy	Thermal Conductivity	0.8 WmK
Color Black	Gray	Pot Life	60 min
Curing Time at Room Temperature	24 hours at 25 degree	Accelerated Curing Time	2 hours at 60 degree
Pot Life 25 minutes	at 25 degree	Operating Temperature Range minus	40 to 125 degree
Packing Specification	50KG per set: Component A: 25KG (in drum) /Component B: 25KG (in drum)

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