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2023J 2105C Epoxy Resin Compound Hardener Modified Polyamide Amine for Electronic Parts Bonding Room Temperature
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2023J 2105C Epoxy Resin Compound Hardener Modified Polyamide Amine for Electronic Parts Bonding Room Temperature

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationOther AdhesivesUsageEpoxy resin curing agent
Main Raw MaterialEpoxyOther NamesEpoxy Hardener
TypeEpoxy Resin Compound HardenerProduct nameEpoxy resin curing agent
MaterialRubber type sealantArticle number2105C
period of validity36 monthsKeywordsTHREEBOND
MOQ12PCSFeatureEasy
Curing MethodRoom temperature curingFeatured Servicestechnical support
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