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Modified Epoxy Conductive Adhesive 16000cps Viscosity 10 MPa Tensile Strength for Semiconductor Transportation
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Modified Epoxy Conductive Adhesive 16000cps Viscosity 10 MPa Tensile Strength for Semiconductor Transportation

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ClassificationDouble Components AdhesivesUsageTransportation, Target binding
Main Raw MaterialSilicone resinCAS No.N/A
MFMixtureOther NamesEpoxy modified thermally and electrically conducti
TypeTwo-partProduct nameEpoxy modified thermally and electrically conducti
MaterialEpoxy adhesivesTensile strength≥10 MPa
Viscosity A&B(10:1)16000 cpsComponentTwo-part
Part A& Part BEpoxy modified resin & Curing agentMixing RatioA:B=(10:1)(Weight ratio)
Hardness65±5Shelf life@ <10℃6 months
ApplicationTarget binding
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