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Modified Epoxy Resin Conductive Two-part Glue High Ag Content for Semiconductor Target Binding and Transportation Applications
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Modified Epoxy Resin Conductive Two-part Glue High Ag Content for Semiconductor Target Binding and Transportation Applications

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageTransportation, Target binding
Main Raw MaterialEpoxyCAS No.N/A
MFMixtureOther NamesEpoxy modified thermally and electrically conducti
TypeTwo-partProduct nameEpoxy modified thermally and electrically conducti
MaterialEpoxy adhesivesTensile strength≥10 MPa
Viscosity A&B(10:1)16000 cpsComponentTwo-part
Part A& Part BEpoxy modified resin & Curing agentMixing RatioA:B=(10:1)(Weight ratio)
Hardness65±5Shelf life@ <10℃6 months
ApplicationTarget binding
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