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HY484 Two component High Voltage Electrical Equipment Adhesive Epoxy Resin Potting Compound Sealant for Electronic
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HY484 Two component High Voltage Electrical Equipment Adhesive Epoxy Resin Potting Compound Sealant for Electronic

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageembedding electronic components
Main Raw MaterialEpoxyEINECS No.500-033-5
CAS No.38891-59-7MFC15H16O2 C2H7O
Other Namesepoxy potting compoundTypeTwo-components
Product nameTwo-Component epoxy potting compoundApplicationelectronic components
Main Materialepoxy resinFeatureself-leveling
Characteristiccold curingAdvantageaging resisitance,moisture resistance,insulation
Keywordselectronic adhesiveFull curing time (h)48
hardness (S.D)≥80CertificateROHSREACH
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