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Bisphenol a Epoxy Resin Clear Liquid Adhesive for Electronics Industrial Coating and Insulating Material for IC Packaging

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Bisphenol a Epoxy Resin Clear Liquid Adhesive for Electronics Industrial Coating and Insulating Material for IC Packaging

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Classification	Other Adhesives	Usage	Construction, Packing, Transportation
Main Raw Material	Epoxy Resin	EINECS No.	500-004-6
CAS No.	38891-59-7	MF	(C11H12O3)n
Other Names	NAN YA EPOXY RESIN	Type	Standard Epoxy Resin

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