what are you looking for?
other
Two-Component Insulation Thermal Conductive Gel 2.0 W/mk High Conductivity Thermal Gel for PCB Applications
Home  /  Products  /  Two-Component Insulation Thermal Conductive Gel 2.0 W/mk High Conductivity Thermal Gel for PCB Applications

Two-Component Insulation Thermal Conductive Gel 2.0 W/mk High Conductivity Thermal Gel for PCB Applications

Inquire Now
Categories
  • Product Detail
We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationOther AdhesivesUsageHigh Temperature
Main Raw MaterialSiliconeEINECS No.UV Resin Kit
CAS No.resin diy kitMFMixture
Other NamesOne part liquid gap fillerTypeTwo Component
ApplicationElectronic equipment heat conductionUseWireless device,Automotive electronics
ColorBlue/white/pinkDensity2.5-3.2g/cm3
Thermal Conductivity2.0-8 W/mkBreakdown voltage≥6kv
Shelf life≤23℃12 monthsProduct nameSilicone Sealant Glue
KeywordsEpoxy Resin LiquidFeatureEco-friendly
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)
Related Products
Details
Low Compression Force Thermal Gel Soft Silicone Conductive Paste for Sensitive Electronic Components Telecommunication IC

Classification Other Adhesives Usage Other Main Raw Material Silicone EINECS No. 9003-07-0 CAS No. 9003-07-0 MF C3H6 Other Names thermal compound Type Thermal Grease Product name Thermal Conductive Gel Material silicone Color green Packing barrel/can/tube/syring Shelf life 12 Months Certificate Reach/ROhs/MSDS Thermal Conductivity 5.0w/m.k

Details
Epoxy modified Silicone Resin IOTA H 60 High temperature Resistant Anti corrosion Coatings Insulating Coatings

Type silicone oil Purity / Classification Chemical Auxiliary Agent MF / CAS No. / EINECS No. / Other Names /

Details
Black Liquid High Temperature Resistant Insulating Electronic Components Potting Epoxy Resin

Classification Double Components Adhesives Usage PU /Epoxy potting Main Raw Material Epoxy EINECS No. 231-545-4 CAS No. 7085-85-0 MF mSiO2 nH2O Other Names Double Components Adhesives Type Liquid Color Black Application electronic components Shelf life 12 Months Epoxy Keywords Epoxy AB Resin Epoxy Certificate ROHS Epoxy Feature Moisture-proof, electrical insulation Mixing ratio (by weight) A:B=5:1

Details
Silver Conductive Epoxy Adhesive AB Epoxy Resin Copper Powder Conductive Adhesive for Electronics Industry Semiconductor

Classification Other Adhesives Usage Construction, Fiber & Garment, Packing, Transportation, Woodworking, Footwear & Leather Main Raw Material Epoxy EINECS No. 201-178-90 CAS No. 68515-73-10 MF C3h4o5Cu Other Names HL-8801 Type AB Resin Glue Name Epoxy Conductive Adhesive Use Semiconductors, motherboards, DIY, industrial, computers, etc. Application Can bond aluminum and graphite, copper and lithium carbonate MOQ […]
Leave A Message
If you are interested in our products and want to know more details,please leave a message here,we will reply you as soon as we can.
Contact Form (#3)

Home

Products

about

contact