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Epoxy Resin High Temperature Resistant Electronic Components Potting Thermal Conductivity 2.0 Special Adhesive for Transformers
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Epoxy Resin High Temperature Resistant Electronic Components Potting Thermal Conductivity 2.0 Special Adhesive for Transformers

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageConstruction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking
Main Raw MaterialEpoxyEINECS No.231-545-4
CAS No.67763-03-05MFmSiO2 nH2O
Other Namesepoxy resin and hardenerTypeTwo Component
Product namePotting Glue For ElectronicKeywordselectronic potting glue
Viscosity13000-17000AdvantageSuitable High Temperate Climates
MOQ1 KGMaterialPure Epoxy
PackingBottle
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