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Thermal Conductive Two Part Epoxy Resin AB Glue Heat Dissipation Waterproof Adhesive for Transformer and Circuit Board
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Thermal Conductive Two Part Epoxy Resin AB Glue Heat Dissipation Waterproof Adhesive for Transformer and Circuit Board

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesMain Raw MaterialEpoxy
EINECS No.231-545-4CAS No.67763-03-05
MFmSiO2 nH2OOther NamesEpoxy quick-drying adhesive
TypeTwo ComponentProduct nameElectronic-pouring sealant
ApplicationSealing ConstructionKeywordselectronic potting glue
Viscosity1500-2000AdvantageSuitable High Temperate Climates
ColorTransparentMaterialPure Epoxy
MOQ1 KGCertificaterohs
PackingBottle
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