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HY484 Low Viscosity Epoxy Potting Sealant Thermally Conductive Flame Retardant Adhesive for Deep Electronic Encapsulation
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HY484 Low Viscosity Epoxy Potting Sealant Thermally Conductive Flame Retardant Adhesive for Deep Electronic Encapsulation

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageembedding electronic components
Main Raw MaterialEpoxyEINECS No.500-033-5
CAS No.38891-59-7MFC15H16O2 C2H7O
Other Namesepoxy potting compoundTypeTwo-components
Product nameTwo-Component epoxy potting compoundApplicationelectronic components
Featureself-levelingAdvantageaging resisitance,moisture resistance,insulation
Keywordselectronic adhesiveFunctionHigh Adhesion Strength
Full curing time (h)48hardness (S.D)≥80
CertificateROHSREACHServiceSample+OEM+ODM+Private Label
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