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High Thermal Conductivity Epoxy Potting Compound for Electronics Flame Retardant V0 Adhesive
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High Thermal Conductivity Epoxy Potting Compound for Electronics Flame Retardant V0 Adhesive

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageElectric power
Main Raw MaterialEpoxy ResinEINECS No.no
CAS No.noMFno
Other NamesEpoxy Potting adhesiveTypeLiquid glue
MaterialEpoxyMixing ratio A:B5:1,10:1,100:12
Operable time (35℃)≥30 minCuring Time (h)25℃ 24-48h / 80℃ 2-4h
Hardness (shore D)>75 / >80Thermal conductivity coefficient (W/mK)≥0.6
Volume resistivity (Ωcm)≥10 13Temperature resistance (℃)-30 – 110℃ / >150℃
Flame retardancyV0keywordsEpoxy Potting Compound
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