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Epoxy Potting Compound Two Component High Hardness Shore D85 Thermal Conductivity 0.3 W/m.K Dielectric Strength 19 5:1
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Epoxy Potting Compound Two Component High Hardness Shore D85 Thermal Conductivity 0.3 W/m.K Dielectric Strength 19 5:1

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

ClassificationDouble Components AdhesivesUsageElectronic Components
Main Raw MaterialEpoxy ResinEINECS No.500-033-5
CAS No.25068-38-6Other NamesEpoxy Potting Compound
TypeTwo-ComponentMaterial TypeTwo-component Epoxy Resin
Mixing Ratio5:1 (A:B by Weight)Density after mixing1.65±0.05 g/cm3
Hardness (Shore D)85 ± 5 DMixed Viscosity1000-2000 mPa.s
Thermal Conductivity≥0.3 W/m.KDielectric Strength19 kV/mm
Service Temperature-50°C to 120°CVolume Shrinkage0.89%
ComplianceRoHS, REACH, VOC Certified
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