| Classification | Double Components Adhesives | Usage | Electrical insulation |
| Main Raw Material | Epoxy | EINECS No. | 216-823-5 |
| CAS No. | 1675-54-3 | MF | C21H24O4 |
| Other Names | Epoxy resin potting compound | Type | Epoxy Resin Compound |
| Keywords | Epoxy Resin Liquid |
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