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Two Component Epoxy Potting Compound Low Viscosity Thermal Conductivity 0.3 W m.K Dielectric Strength 19 KV mm
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Two Component Epoxy Potting Compound Low Viscosity Thermal Conductivity 0.3 W m.K Dielectric Strength 19 KV mm

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ClassificationDouble Components AdhesivesUsageElectronic Components
Main Raw MaterialEpoxy ResinEINECS No.500-033-5
CAS No.25068-38-6Other NamesEpoxy Potting Compound
TypeTwo-ComponentMaterial TypeTwo-component Epoxy Resin
Mixing Ratio5:1 (A:B by Weight)Density after mixing1.65±0.05 g/cm3
Hardness (Shore D)85 ± 5 DMixed Viscosity1000-2000 mPa.s
Thermal Conductivity≥0.3 W/m.KDielectric Strength19 kV/mm
Service Temperature-50°C to 120°CVolume Shrinkage0.89%
ComplianceRoHS, REACH, VOC Certified
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