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Two Component Epoxy Potting Compound for Electronic Parts High Hardness Low Shrinkage Waterproof Insulation Glue

Home / Products / Two Component Epoxy Potting Compound for Electronic Parts High Hardness Low Shrinkage Waterproof Insulation Glue

Two Component Epoxy Potting Compound for Electronic Parts High Hardness Low Shrinkage Waterproof Insulation Glue

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We can offer a variety of packaging options and produce products according to the customer's OEM specifications, including different sizes such as buckets and bottles, as well as varying weights.

Classification	Double Components Adhesives	Usage	Construction + Electronics
Main Raw Material	Epoxy	Product name	Epoxy Potting Glue
Keywords	Epoxy adhesive series	Application	Power supply, transformer, PCB circuit board
Factory advantage	Stable output	Advantage	Excellent adhesion performance, Available for repacking
Delivery time	7-15 Days	One set	50kg
Test Report	RoHS,FDA,REACH,TSCA,	Content per set	25kg per Component A & Component B per set

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